GDY-065
PE UV-Relief Adhesion Film
Initial tack above 1000 g; after UV or heat de-tacking the peel force drops below 20 g — easy removal with completely residue-free surfaces, designed for wafer and semiconductor process protection.
- Good processability, easy die-cutting
- 加工性能好，易于冲切
- Gia công tốt, dễ bế
- แปรรูปง่าย ไดคัทง่าย
- Pemrosesan baik, mudah die-cut
- Pemprosesan baik, mudah die-cut
- قابلية تصنيع جيدة وسهل القطع
Specifications
- Width
- 150–2100mm
- Roll length
- 200–1000m
- Thickness
- 0.02–0.20mm
- Peel strength
- 30–300g/25mm
- Colour options
- clear / milky white / blue / black-white
- Printability
- up to 4 colours
- Initial tack
- ≥1000g/25mm
- Peel after UV/heat de-tacking
- ≤20g/25mm
Structure
- 1.Dense low-bubble PE film layer
- 2.致密低气泡 PE 膜层
- 3.Lớp màng PE đặc ít bọt
- 4.ชั้นฟิล์ม PE แน่นฟองน้อย
- 5.Lapisan film PE padat
- 6.Lapisan filem PE padat
- 7.طبقة فيلم PE كثيفة قليلة الفقاعات
Applications
Wafer and semiconductor process protection晶圆加工、半导体处理保护Bảo vệ wafer, bán dẫnป้องกันเวเฟอร์และเซมิคอนดักเตอร์Proteksi wafer dan semikonduktorPerlindungan wafer dan semikonduktorحماية الرقائق وأشباه الموصلات
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