GDY-016
UV Adhesion-Relief Film
Excellent die-cutting; initial adhesion above 1000g drops below 20g after UV irradiation or heating — easy peel with no residue and strong internal cohesion.
- Excellent die-cutting performance, easy to die-cut
- Initial adhesion >1000g drops below 20g after UV/heating, completely residue-free
- Stable bonding, strong internal cohesion and holding power
Specifications
- Adhesion
- ≥1000 → <20g
- Suitable processes
- Wafer & semiconductor processing, OGS screens, mobile cover film processing
Structure
- 1.Release liner
- 2.UV-relief adhesive layer
- 3.PET film layer
Applications
Wafer and semiconductor process protectionScreen/OGS process protectionMobile cover film processing and glass protector production
Ready to protect your products?
Send us your requirements — free samples and a tailored solution within 24 hours.
Contact our team